It is suitable for precision cutting of brittle materials such as sapphire glass, camera cover, (fingerprint identification cover) Home button.
Brittle Material Laser Cutting Machine
1. Using picosecond laser, ultra-short pulse processing without heat conduction, to ensure good processing quality of materials;
2. Adopt automatic dust collection system, which is safe and environmentally friendly, and avoids contamination of the ring mirror;
3. Equipped with a coaxial CCD visual positioning system to meet the high-precision requirements of the product and improve the production efficiency of the product;
4. Non-contact processing, the material does not have any stress contact during the laser cutting process, ensuring the stability of product production;
5. It can be matched with automatic loading and unloading and swinging module to realize fully automatic production.
Application industry: 3C consumer electronics, automotive electronics, smart home, medical and other industries
Application field: precision cutting of brittle materials such as sapphire glass, camera cover, home button, etc.
Maximum processing width
The maximum operating speed of the platform
Platform positioning accuracy
Comprehensive machining accuracy
Galvo scanning range
50×50mm（Can be set according to demand）
Power supply and power
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